Huawei Unveils ‘LogicFolding’ and Tau Scaling Law, Targets 1.4-nm-Class Chips by 2031 Without EUV
On 25 May 2026, Huawei publicly committed to achieving 1.4-nm-equivalent chip density by 2031 via a new 3-D “LogicFolding” architecture instead of EUV lithography, formally marking its exit from the conventional Moore’s-Law scaling race constrained by U.S. export bans.